Archive: 2023年 8月 22日

Which plating option is best for my connector?

Choosing the right coating is critical to the success of your connector system. Electroplating can affect the performance, life cycle, quality and cost of connectors.

The main costs of the connector are the plastic body, the pins, the plating on the pins, the labor to assemble it, and the packaging. For most connectors, the larger items are pins and plating.

For example, on micro-pitch, high-density interconnect products, pins and plating can account for about 25%-30% of the total cost of the connector. But on the basic 2.54mm centerline terminal strip (” pin holder “), it can account for 60%-70% of the total cost of the connector.

This is because the relative size of the plastic body on a miniature, mould-to-position miniature connector is almost always larger than the body basically cut into place on a strip-line connector. And, of course, if you use gold plating, the pins will cost more.

As I mentioned in my previous blog, I can’t speak for all connector companies when it comes to cost. Most of the examples I’ve used here have to do with Samtec interconnect, but I bet these principles apply to other connector companies as well.

What do we recommend?

Designers often ask us which plating finish we recommend. There are many considerations to consider (as evidenced by the variety of plating options on most basic connectors), but the best plating surface finish meets your system requirements at the lowest cost. In other words, make sure it works and meets your quality design specifications, but don’t over-engineer it on plating.

gild

Gold is usually specified for high reliability, low voltage or low current applications. Gold is used in high cycle applications because it is rugged and has excellent wear resistance (this is an example of a high cycle connector). Our gold is alloyed with cobalt, which increases the hardness. We also recommend using gold in harsh environments, as it will remain free of oxides that can cause an increase in contact resistance.

Gold is a precious metal, which means it doesn’t react much to the environment.

tinning

Tin is a lower cost alternative to gold and has excellent weldability. Unlike gold, tin is not a precious metal. The tin plating begins to oxidize the moment it is exposed to air. Therefore, the tinning contact system requires a larger normal force and a longer contact wiping area to break through this oxide film

On top of that, tin is better suited for applications with fewer cycles because of the extra force exerted on the contacts, and simply because it is a softer metal.

Normal force

The difference between gold and tin comes down to the normal force. Compared to tin, gold requires a much lower normal force. Fine-pitch connectors do not have room for relatively large, thick contact beams with high deflection; This is necessary to produce the normal force tin required for tin-plated contacts.

Therefore, due to the physical size limitations of miniature connectors, gold is usually the only option. In other words, we use tin if we can. Tin is used in connector contact areas where appropriate normal forces can be generated and in benign environments. Tin oxidizes, so higher normal forces and contact wiping are required to break through the inherent oxide layer. Again, check out the video above.

Optional gold + tin plating options

Selective gold-plated tin is Samtec’s most popular plating option because it offers designers the best of both worlds. The contact area is the key area for contact and terminal pin interface and transmission signal, with gold reliability. The tail welded to the circuit board has the low cost and weldability of tin.

Tin lead, sparkly gold palladium nickel

Of course, other plating options are also available for specific applications. Two common examples include tinned lead and glitter palladium nickel. Tin lead is used in military applications and its advantages include low eutectic temperature, and the presence of lead inhibits tin whisker formation. Palladium nickel for extremely high cycle applications. However, for most typical applications, gold, tin, or selective plating will work fine.

Quick summary

Gold for high reliability, high cycle, low voltage applications.

Tin is used for applications that have fewer cycles, are cheaper, and can accommodate solder.

Selective plating, using gold in the contact fitting area and tinning at the tail, is usually the best choice.

Understanding IPC Class 2 vs Class 3 Solder Joints

In the manufacturing world there are standards for just about everything, and they all are typically there to ensure a product can perform as expected for the end application. Among these standards is IPC-A-610 covering solder joints for varying types of connector termination styles.

we are going to take a quick look at IPC-A-610 Class 2 and Class 3 solder joints, and some of the requirements of those two classifications. To narrow the focus further, we are looking at a J-Lead solder joint exclusively.

What is IPC-A-610?

IPC-A-610 covers the “Acceptability of Electronic Assemblies,” and more specifically for this blog we will look at the requirements for J-Lead solder connections. Since varying applications have different requirements, IPC has different classes and what a solder joints must look like to meet those class requirements.

Class 2 (J-Lead Components)

Class 3 (J-Lead Components)

Many of Samtec’s products can meet IPC-A-610 Class 3 which is normally required when a product must have continued high performance in extreme / harsh conditions. Mil / Aero and Medical applications typically require Class 3 products.

Class 3 increases the requirements in most areas of inspection for the solder joint over Class 2. The solder thickness (5) requirement remains “not specified,” and the side joint length (6) are the same as Class 2, but many of the other specifications have increased requirements.

For instance, the side overhang (2) and end joint width (3), are tightened in both directions by 25%. The side overhang is lowered to a 25% maximum of the width of the lead (4), and end joint thickness (3) is increased to a minimum of 75% of the lead width (4). While this may not seem to be a huge increase, it does add to the difficulty of producing a conforming product.

Insulation Resistance and Dielectric Withstanding Voltage Testing

That’s shocking! Insulation Resistance and Dielectric Withstanding Voltage are two of the qualification tests that Samtec performs in-house during part qualification testing.

These tests will ensure that when a connector is used in environmental conditions at the rated working voltage (de-rated from the test voltage) the product will not fail, and there will not be current leakage.

Insulation Resistance Testing

The purpose of the Insulation Resistance (IR) test is to determine the resistance of the insulation materials to leakage of current. This is measured on the surface while DC potential is applied at 500 VDC. 

There are several variables that can cause a part to fail prior to its calculated results; condensation on the part,  a crack in the body, and damage to the insulation.

Samtec tests it parts according to EIA-364-21 “Insulation Resistance Test Procedure for Electrical Connectors, Sockets, and Coaxial Contacts.”

Dielectric Withstanding Voltage Testing

The Dielectric Withstanding Voltage (DWV) test is intended to take into account momentary over potentials caused from switching, surges,and other phenomenon. This establishes the proper operation at a test voltage that is three times the rated working voltage of the system under the test. 

DWV is determined from the breakdown voltage (BDV) of a part (DWV = 0.75 x BDV). The BDV is the voltage where the part arcs across the metallic interface; think pin-to-pin or pin-to-hardware, and working voltage is = 1/3 x DWV or 0.25 x BDV.

For example: if the breakdown voltage is 1000 VAC the Test Voltage will be 750 VAC, and Working Voltage will be 250 VAC.  DWV is tested by applying the calculated test voltage for 60 seconds.  The part will pass if there is no indication of arcing. 

For DWV, Samtec uses EIA-364-20 “Withstanding Voltage Test Procedure for Electrical Connectors, Sockets, and Coaxial Contacts.”

Why test IR/DWV?

Bottom line, IR /DWV are part of determining a connector’s performance in varying conditions.  The test sequence for both IR/DWV involves using thermal shock and humidity cycling.  By testing under these conditions, Samtec is confident that its parts will perform in less than ideal environments.

The Diverse Connector Market

The connector marketplace is one of the most diverse and interesting in the entire electronics industry.  The roles that connectors are required to play range from the smallest data connections to the largest power supplies.  They are frequently employed in some of the toughest conditions on Earth and despite this are expected to provide remarkable levels of reliability.  As a result, the industry has responded with a quite bewildering array of choices.

Gigat dump trucks are working in the mine for the production of apatite in the Murmansk region carrying rock. Extraction of minerals in the harsh highlands.

Many connectors are designed as solutions for particular markets.  When faced with the entire connector marketplace, we therefore often ignore certain connectors from our potential list of choices because we assume they do not cater to our own industry.  This is quite understandable as specifying a connector can be a little daunting.

Self-Imposed Rules

After a time, these assumptions can become rules that we create for ourselves.  However, when it comes to connectors, many of these rules can be broken.  When creating a new device, the key task for any engineer should be to pick the product that will best solve their design challenge, and as with many things in life there are often more ways than one to proceed.  If we ignore the rules and investigate products that we would normally disregard, there are surprising things we can learn.

This is not limited to the world of connectors, or even the electronics industry.  The largest tire manufacturer in the world is not Continental or Dunlop, it is the Danish toy company LEGO.  And who would have imagined that global giant Volkswagen makes more sausages than cars every year?  Although these examples are not of hugely practical value (unless you want a Currywurst sausage, in which case I can thoroughly recommend the Volkswagen product), the connector industry does offer some intriguing possibilities.

Looking Beyond the Perception

There are entire categories of products that were designed for one application but are suited for others.  I have been a long advocate for the use of automotive connectors in industrial settings. Connectors intended for use in vehicles have much to offer the industrial engineer.  They have been designed to survive the harsh conditions found in some of the most demanding environments, from extremes of temperature to contamination by mud and dirt. 

Automotive-grade connectors are designed for use in mass-produced vehicles, and they are made in huge quantities for the global market.  This makes them cost-effective and easy to obtain. It also means that the tooling and expertise needed to terminate them are both easy to find.

The automotive industry is not alone in its need for dedicated connectors.  The military and aerospace sector has always had a lot to say about the connectors it uses.  A significant number of connectors are created to provide the high performance demanded by the defense industry. They are made to work in tough conditions, which are not always limited to the battlefield. 

Geological instrumentation, industrial automation, commercial vehicles – the list of potential applications for which a high-performance connector might be suitable is virtually endless.  Engineers the world over need a connector that must be mated and unmated frequently, that will be exposed to wind and weather, or must be shielded against unwanted electromagnetic interference (EMI).  If any of these conditions sound familiar, then a connector designed to military requirements might provide a solution for you.

The Diverse Market

When it comes to choosing connectors, there is often a different way to achieve your goal.  The conventional view can make us assume that a particular product type will not be suitable for our needs.  But that same conventional view can stop us from seeing the tremendous innovation that occurs throughout the industry.

Do not let convention dictate how you choose connectors.  Allow your engineering needs to be the guide that leads you to a solution.  Be clear about the features you require, decide on the connector that suits your application, and ignore the rules. Make sure you look at our applications page to see what might inspire your next design

A New Angle On Power/Signal High-Density Arrays

Angles surround us every day – physical angles like the corner over there, and angles of perspective. Samtec’s new AcceleRate® mP high-density power/signal interconnect system was born out of a different perspective on power integrity and a 90 degree rotation.

Best in class density for a power/signal interconnect system, AcceleRate® mP achieves up to 240 I/Os in .438 sq. inches. It also packs a punch with up to 22 Amps per power blade and 56 Gbps signal performance.

SRotated Power Blades

AcceleRate® mP features power blades rotated 90 degrees, giving equal access to heat escape for uniform cooling and increased current capacity up to 20% compared to similar blade style pins. The breakout region (BOR) is also simplified, as this connector system is designed to maximize current capabilities and minimize distribution resistance in the same form factor, ultimately reducing current crowding.

Design Flexibility

This high-density, multi row design is open-pin-field for grounding and routing flexibility – up to 240 signal pins in 6 rows and 4 or 8 total power blades in a low 5 mm stack height. Additional signal and power blade counts, plus stack heights up to 16 mm, are in development to accommodate a wider range of applications. Optional 10 µ” or 30 µ” gold plating on contacts with matte tin tail is available to meet specific regulations.

Ruggedizing features for AcceleRate® mP include alignment pins and through-hole weld tabs for a secure connection to the board. For assistance with blind mating, polarized guide posts are part of the standard connector body.

For more about power and signal integrity regarding AcceleRate® mP, check out this post.

AcceleRate® Family of Products

AcceleRate® mP is part of a quickly growing family of extreme density and extreme performance interconnects packaged in small form factors. Click here to learn more about other AcceleRate® products such as Flyover® cable assemblies, and other high-density board level connectors.

Samtec Expands ExaMAX® High-Speed Backplane Connector System With New DMO Options

Samtec supports orthogonal backplane architectures with new DMO options from within the ExaMAX® High-Speed Backplane Connector System.

Samtec ExaMAX® DMO Options

Samtec’s new ExaMAX® DMO solutions offer system designers flexibility by removing the mid-plane, allowing fabric cards and line cards to mate directly. This fast-growing system architecture increases airflow and improves thermal efficiencies throughout the chassis. DMO solutions enhance signal integrity via shorter trace lengths and fewer connector transitions while streamlining the system BOM and optimizing system cost.

Samtec’s ExaMAX® DMO system consists of the new EBDM-RA series which mates directly with existing EBTF-RA series. Currently both 6 pair x 10 column and 6 pair x 12 column solutions are available. Guide pin and screw mount options are also available. 6 pair x 6 column and 6 pair x 8 column options are under development.

“Next generation system designers are quickly adopting DMO architectures,” said Jonathan Sprigler, Backplane Product Manager at Samtec, Inc. “Leading equipment vendors from across the data center industry – storage, server, networking and other applications – are leveraging the advantages of DMO via Samtec’s new EBDM-RA series.”

Key ExaMAX® Technical Features

Samtec’s EBDM-RA series is but one solution from the ExaMAX® High-Speed Backplane Connector System. The ExaMAX® line of products is optimized for speeds up to 56 Gbps (PAM-4 modulation). Return loss compliance is achieved in both 85 Ω and 100 Ω systems due to targeting the 92 Ω specifications and controlling reflections at all geometry transitions within the connector.

ExaMAX® also has the industry’s lowest mating force with excellent normal force and meets Telcordia GR-1217 CORE specifications. With two reliable points of contact at all times, even when subjected to angled mating, residual stubs are minimized for improved signal integrity performance. A 2.4 mm contact wipe increases reliability while the hermaphroditic mating interface ensures stub-free mating and reliable alignment

The backplane system features individual signal wafers with differential pairs in a staggered design and arranged in columns with zero skew. Each wafer includes a one-piece embossed ground structure, which increases isolation to significantly decrease crosstalk.

SAMTEC and its connector products are introduced

Samtec is a global electronic connector manufacturer headquartered in the United States. Founded in 1976, it had global sales of $822 million in 2019 and about $160 million in China. With six factories in the world, located in the United States, Panama, Malaysia, Singapore and Huizhou, China, SAMTEC has always been known for its fast delivery, so it has a reputation in the industry “SUNDDEN-SERVICE”, that is, lightning service. As a technology leader in the electronic connector industry, Samtec has been adhering to the Sudden Service concept to provide excellent service, high-quality products and convenient design tools worldwide, including high-speed board to board, high-speed cable components, micro-pitch/durable, flexible board to board stacking, optical modules, precision RF and other interconnection products. With more than 40 sales/service offices around the world, the products are widely used in more than 125 countries and regions in the industrial, data communication, computer, semiconductor, instrumentation, aerospace, medical, automotive electronics, consumer and other fields.

Samtec is divided into nine main categories: High-speed high-density board-to-board connectors, high-speed slot connectors, small-pitch high-reliability connectors, standard height adjustable connectors, reliable power connectors, high-speed cable cables, IDC& DISCRETE cable cables, active optical jumpers and high-speed I/O and waterproof connectors, Especially for board end connectors (the top five are all), the market share is in the top ten of all connector brands.

Main advantages of the product:

1, high speed, speed single pin can reach 28Gbps+;

2, reliable, multi-point contact, locking design;

3, flexible and diverse, even in the standard products there are a variety of optional parameters to meet the different needs of customers, but also accept customer products;

4, better service, each product in the design of mechanical, electrical and environmental testing, to ensure product quality, can be provided to customers as recognized materials, at the same time, Samtec also provides various software versions of PCB latout, Customers only need to copy the layout of the connector to their total PCB layout, and do not need to spend too much time for this;

5, can provide free samples, this is very important for developers;

6,Compared with foreign brands, the delivery time is short, normally 4-6 weeks, and the sample can arrive within a week. Market: samtec’s products occupy the top several positions in instrumentation and the top ten positions in the medical industry. Besides, samtec’s products have more advantages in the communication industry, especially in some large data storage equipment requiring high-speed transmission.

Samtec High-Speed Board-to-Board Interconnect connectors

Samtec offers the largest variety of high-speed board-to-board connectors in the industry. Samtec’s High-Speed Board-to-Board Solutionator® provides users with mated connector sets in seconds. The UltraSOM uses several Samtec solutions to attach the SoM to a customer-design carrier card.

UltraSOM routes up to 220 GPIOs from the SoC to the connector. Samtec Edge Rate® rugged high cycle connectors feature contact systems optimized for SI. The smooth, milled surface reduces wear and tear while lowering insertion and withdrawal forces.

UltraSOM comes in two different options. The UltraSOM A variant targets applications using Artix UltraScale+ devices supporting between 96-308k logic cells. Similarly, the UltraSOM K variant targets applications using Kintex UltraScale+ devices supporting between 356-475k logic cells.

Key highlights of the UltraSOMs include:

●System on Module for development and series products

●World’s only SOM board for 4 types of Artix UltraScale+ and 2 types of Kintex UltraScale+ FPGAs.

●World’s only SOM board for low-cost PCIe 4.0 solutions with AMD FPGAs

●Mutiple High-Speed Gigabit Transceivers

UltraSOM A: 12x XCVRs up to 16 Gbps

UltraSOM K: 16x XCVRs up to 32 Gbps

PCI Express® support

●2500 Mbit/s MIPI Support

●DDR4 RAM 2400 Mbit/s onboard

●2x 128 Mbit SPI-Flash onboard (config and general purpose)

●up to 220 GPIOs (max. 148 HP, 64 HD, 8 Pmod IOs)

●small SOM board size (80 mm x 50 mm)

●Design support including schematics, PCBs layouts, IP cores and more

UltraSOM also features several high-speed multigigabit transceivers, so a higher performance solution is needed. That’s where the AcceleRate® HP High-Performance Arrays come in. The dense 0.635 mm pitch and configurable open-pin-field design support 112 Gbps PAM4 performance.

1.35 mm Precision RF Products to 90 GHz

Samtec has released its 1.35 mm family of products suitable for millimeter wave applications to 90 GHz. The 1.35 mm family includes compression mount board connectors (135 Series), cable connectors (PRF13 Series) and .047″ low-loss flexible cable assemblies (RF047-A Series). 1.35 mm products are ideal for IEEE, E-band applications due to their high operating frequency and electrical precision.

Samtec’s 1.35 mm board connectors are the industry’s only vertical compression mount product using the 1.35 mm interface. The solderless launch allows for easy, field-replaceable, cost-effective assembly to the board. Threaded coupling provides superior repeatability and mechanical stability. Microstrip and stripline options are available.

The RF047-A Series cable assembly, using 1.35 mm cable connectors, provides a frequency range of DC to 90 GHz and a maximum VSWR of 1.5:1. It also features a 5 mm minimum bend radius and insertion loss of 5 dB/ft at 90 GHz.

The Samtec PRF13 product is a series of solder clamp, straight plug, or bulkhead jack 1.35 mm cable connectors that fit industry-standard .047″ flexible cable.

Understanding that the interface between a high-frequency, air dielectric coaxial connector and a PCB is complex, Samtec offers technical support for board launch optimization and channel analysis. Simulation and physical test and measurement verification services are also available.

In addition to 1.35 mm products, Samtec offers a full line of off-the-shelf solutions suitable for microwave and millimeter wave applications from 18 GHz to 110 GHz. Samtec precision RF products support next-generation technology advancements in wireless communication, automotive, radar, SATCOM, aerospace, defense, and test & measurement. Customization of products, both quick-turn modifications, and new designs, is also available.

What are the characteristics of the 5 common plastic materials used in connectors?

Connectors are made from various materials, and different materials are suitable for different applications. Whether in procurement or when using connectors, we need to consider their materials.

In this article, let’s take a look at the characteristics of the commonly used plastic materials in connectors:

1.Nylon:

Nylon possesses good toughness, self-lubrication, chemical resistance, and wear resistance. PA6T exhibits excellent weldability, dimensional stability, minimal warping during the molding process, and good thin-wall molding capability, making it suitable for processing small components. PA9T generates fewer gas emissions compared to other nylon resins, resulting in less contamination and corrosion of molds, thereby extending the mold’s lifespan. It maintains mechanical strength and rigidity relatively well in high-temperature environments and exhibits good solder joint strength and recyclability.

2.PPS:

PPS exhibits good rigidity, low water absorption, excellent dimensional stability, and outstanding thermal performance. It can withstand temperatures up to 260°C in the short term and can be used continuously at temperatures ranging from 200°C to 240°C. PPS has excellent electrical properties, with low dielectric constant and dielectric loss tangent compared to other engineering plastics, making it commonly used as electrical insulation material. However, PPS has a slow crystallization speed, which may result in product flash and relatively poor toughness.

3.LCP:

 LCP offers excellent electrical insulation performance and can maintain its electrical properties from 200°C to 300°C. It exhibits strong corrosion resistance and is not affected by 90% acidity or 50% alkaline environments. LCP also demonstrates outstanding thermal stability, heat resistance, and chemical resistance. However, the use of LCP in connector products tends to be more expensive due to its high material cost.

4.PBT:

PBT has low viscosity and good flowability in its molten state. It has low moisture absorption and maintains good electrical stability under humid and high-temperature conditions. However, PBT exhibits significant post-molding shrinkage and relatively lower heat resistance, making it unsuitable for SMT (Surface Mount Technology) but suitable for DIP (Dual In-line Package) connectors.

5.PET:

 PET is a crystalline engineering plastic with a melting point of 245-260°C. It offers good mechanical and electrical properties, as well as solvent resistance. However, PET has some drawbacks, including anisotropy, significant shrinkage, slow crystallization speed, and a requirement for thorough drying.

These are the characteristics of the five commonly used plastic materials in connectors.