Archive: 2023年 8月 31日

Introduction and Applications of ERNI Power Taps Series Connectors

ERNI power taps in grids of 2.54 millimeters are developed especially for the power supply on the PCB and backplane. They are available in various designs with six or ten connection pins and as dip solder or pressfit variants. Depending on the cable connection and PCB, operating currents up to 40 amperes can be realized. For the variants with screw connection, the cable connection is possible with commercially available cable lugs. This provides high flexibility for the connections.

Our power taps can be used anywhere that PCBs must be supplied with power. Thanks to the high current carrying capacity of up to 40 ampere, even higher power can be transmitted via the taps. Dip solder and pressfit variants enable economical processes Typical applications can be found in the automotive area. Thus the ERNI power taps can be used for example in battery management systems for hybrid and electric vehicles.

Our power taps enable reliable transmission of electrical energy to the PCBs required for operation. They have a high current carrying capability and are flexible to process by pressfit or dip solder technology.

Introduction and Applications of ERNI MiniBridge Connectors

The ERNI MiniBridge connectors have a miniaturized shape in 1.27-mm grid and can be used everywhere that space-saving connections between PCBs and decentralized functional units must be implemented. The single row cable mating system is available with straight and angled male terminal strips. All mating variants can be used in combination with female terminal strips having 90° and 180° cable outlet. The Koshiri variants of the connectors offer especially high mating reliability.

The automotive area is one of the most important areas of use for the MiniBridge connectors. The connectors offer high vibration and impact resistance and meet the applicable specifications of  LV 214 for automobile connectors. Even high temperatures in the headlight area cannot harm the connectors.

Other areas of use are battery management systems and power electronics. Thanks to their compact shape, ruggedized and multiple mating variants, MiniBridge connectors are also widely used in the industrial environment. In medical technology they are in practical mating systems in ultrasonic devices, MRI devices, lab instruments and diverse diagnostic equipment..

MiniBridge connectors are an ideal solution everywhere that  there are space-saving, reliable and high rated connections. They are suitable for use in the automotive area or in industry and medical technology.

Introduction and Applications of ERNI MicroSpeed Series Connectors

The MicroSpeed connector system is a guarantee for high data transmission rates. Thanks to outstanding signal integrity, data rates up to 25 Gbit/s can be realized. The space-saving, interference-proof connectors are maximally electromagnetically compatible and safe. Typical application areas can be found in industrial automation. For Internet of Things and Industry 4.0  MicroSpeed connectors are ideal. Furthermore  they are generally suitable for data- and telecommunication and high-end computing. Despite miniaturized shape, the connectors have proven reliability and a high degree of robustness.

MicroSpeed connectors are tailor-made for use in information and telecommunication technology. They are also especially suitable for use in industrial automation. Their high resilience and safety guarantees smooth flow in all areas of production, processing and logistics and provides there a decisive contribution to control and drive technology. The MicroSpeed connector system especially shows its strengths in the transmission of large data volumes between controller and IO modules.

The robust design of the connectors with double-shanked spring contacts and high reliability under harsh ambient conditions make them well suited for industrial use. They can be used for factory and process automation or PLC and DCS controls.

MicroSpeed connectors reach high data rates and have small space requirements. They can be used everywhere high signal integrity and speed are required.

Introduction and Applications of ERNI MicroSpeed Power Module Series Connectors

MicroSpeed Power is a 5-pin connector system with a contact pitch of 2.0 millimeters. The connector system is the complementary power component to the signal connectors of the MicroSpeed series. Its unique property is its high current carrying capacity, despite its small dimensions. MicroSpeed Power modules are ideal for providing the power supply to high-performing, compact elements such as processors, LCD displays or drives, like those used in automation, measurement technology, medical technology, or information technology. Thanks to a broad range of different types and many different heights of male and female connectors, developers have excellent flexibility when arranging circuit boards. Stack heights of five to 20 millimeters are possible. MicroSpeed Power connectors can be finished fully automatically.

Connectors from the MicroSpeed Power module series are ideal for applications where compact, high-performing elements need to be supplied reliably with electrical energy. They are used, for example, to supply energy to processors, drives or LCD displays in automation, telecommunication, measurement technology and medical technology applications. The integrated 3-point female contact ensures low contact resistance and secure contacting throughout the entire life cycle of the connector.

As complementary power components, and as an optimal addition to signal plugs in the MicroSpeed series, MicroSpeed Power module connectors are ideal for use in industrial automation. Thanks to their excellent durability and reliability, they help guarantee seamless processes in production, finishing and logistics. The connectors help ensure the reliable operation of control and drive technology under difficult industrial conditions, including when exposed to high levels of shock or vibrations. Typical applications include providing a power supply to DCS and PLC controllers for plant and process automation. While the signal connectors in this connector series ensure high-quality signal transmission at high data rates, the Power modules deliver the electrical power needed for components such as processors, sensors, actuators or drives, despite their small dimensions. The developers of the device offer a broad range of different connector types with male and female contacts of different heights. These allow for many different circuit board arrangements. Good contact coverage is ensured, even with the smallest board-to-board spacing. The SMT components fulfill all the requirements of modern, fully-automated assembly machines in manufacturing. Thanks to one hundred percent mechanical testing, operators can achieve perfect soldering results, resulting in highly reliable industrial automation systems.

ERNI connectors from the MicroSpeed Power module series offer power supply solutions for high-performing electronic components in industrial automation, telecommunication technology and other applications. They are reliable, and stand out for their excellent current carrying capacity.

High -performance EMC shielding design connector

Zenshield® is the brand name of the I-PEX small connector series. These small connectors have high-performance EMC shielding design. Zenshield® provides engineers with greater flexibility to design lineboards. It makes the connector closer to the sensitive subsystem, such as launch/receiving antenna, which is a common high -performance wireless communication system.

Zenshield® is the brand name of the I-PEX small connector series. These small connectors have high-performance EMC shielding design.

With the development of high -speed Internet and the use of large -capacity storage equipment, high -resolution images and videos can be easier to share on consumer products such as personal computers, tablets and smartphones. The amount of information processed on these devices has increased sharply, and the signal speed in the device is getting faster and faster.

When electromagnetic noise is existed outside the electronic device, non -expected electrical signals may be imported from the circuit inside the device, causing faults or damage to high -performance electronic components, and may also cause damage to electronic equipment.

The second type of problem is when the electromagnetic noise generated by the digital timing signal or electronic component in the device causes other components in the same system to fail. This is called an EMC (electromagnetic compatibility) problem in the system. This often causes headaches for engineers. They must develop and install high -density electronic components, high -performance handheld or portable electronic equipment. When these types of devices need to be interconnected, in order to prevent electromagnetic noise from becoming a problem, connectors with electromagnetic interference shielding functions often need to be needed.

The unique shielding design of the I-PEX ZENSHIELD® connector series can provide excellent electromagnetic interference countermeasures.

The 360 -degree EMC shielding design can not only prevent electromagnetic noise radiation from the contact point of the public and mother seats, but also prevent electromagnetic noise radiation from the lineboard installation part (SMT position) from the signal terminal. In addition, when the connector is cocks and correctly ground to the line board, the public seat and the mother seat shielding cover is correctly connected to multi -point ground. This ensures that the current generated in the metal shield of the connector has sufficient ground return path. This is to suppress the electromagnetic noise of the shielding layer.

Zenshield® connector series design:

1. The entire connector is blocked by 360 degrees, including the public seat and the mother seat -not only the terminal part of the signal terminal, but also the lineplate installation part (SMT position).

2. The shielding cover-shielding interface between the public seat and the mother seat is effectively connected on multiple points.

3. In addition, the interface of the connecter shielding cover-line board is effectively grounded at multiple points, thereby improving the ground return path.

With these design characteristics, the connector itself provides a significant EMI relief. Zenshield® provides engineers with greater flexibility to design lineboards. It makes the connector closer to the sensitive subsystem, such as launch/receiving antenna, which is a common high -performance wireless communication system.

The Zenshield® connector series that can be provided:

The I-PEX Zenshield® connector series provides a variety of electromagnetic interference shielding connectors to meet various applications and design conditions.

Extremely fine coaxial connector:

Cabline®-CA II/CA II Plus (0.4 mm pitch, horizontal plug-in style, mechanical lock function)

Cabline®-VS II (0.5 mm pitch, horizontal plug-in style, mechanical lock function)

Cabline®-UM (0.4 mm pitch, vertical plug-in style, automatic locking function)

RF connector:

MHF® 7s (packaging 2.0 x 2.0 mm, as high as 15 GHz)

Board panel (FPC) connector:

NOVASTACK® 35-HDP (supports high-speed transmission (20+ GBPS/LANE) full shielding structure, with a power supply terminal, 0.35 mm spacing, height: 0.7 mm)

NOVASTACK® 35-HDN (suitable for 5G MMWAVE antenna module and equipment, full shielding and narrow design, the power supply adopts Cordon alloy terminal, 0.35 mm pitch, height 0.7 mm)

Novastack® 35-HDH (height 1.5 mm, 0.35 mm spacing, full shielding, high-back design, high-speed 20 GHz (≒ 40 GBPS)/channel transmission)

FPC/FFC connector:

EVAFLEX® 5-HD (0.5 mm pitch, with automatic lock function)

Cabline®-CA IIF (0.4 mm pitch, mechanical lock function)

Cabline®-VS IIF (0.5 mm pitch, with mechanical lock function)

Related term:

* Electromagnetic interference (EMI):

There are two types of electromagnetic interference conduction pathways: radiation and/or conduction.

1. When high -frequency signals are spread on the conductive surface (or wire or PCB lead), the electromagnetic field that changes over time, that is, radiation interference. This electromagnetic field can be detected (radiation) at a certain distance from that surface. The closer the distance between the light source and the adjacent surface (or wire or PCB), the larger the detected coupling field. Since the adjacent surface is conductive, it acts the voltage and current when the electromagnetic field exists. Solving this problem usually requires shielding housing, cables and connectors. If no part of the system is shielded, it will be an EMI radiation leakage point.

2. When the intention (or unintentional) signal in the circuit is directly moved from one place to another through the wire (or wire or PCB lead), it will interfere with the normal operation of the target circuit or device that is transmitted. Electric power line is an example of conduction interference. In this case, use a wire filter, capacitor network, and similar methods to separate (or adjust) voltage signals from interference voltage.

Novastack® 35-HDP/shielding board panel to FPC connector

It is suitable for 5G MMWAVE antenna module and equipment, full shielding and narrow design. The power supply adopts Coson alloy terminal, supports high -speed transmission (20+ GBPS) full shielding structure, with a power supply terminal of 0.35 mm pitch, a height of 0.7 mm

product structure

Product Size

Power terminal

High -performance EMC shielding design

I-PEX has developed a connector series that solves the problem of electromagnetic noise in the connector. It has a suitable ground structure and coverage layer, including the installation position of the signal terminal with metal shielding (Zenshield®) Essence This solution is widely adopted by many customers to prevent electromagnetic interference, especially on high-performance devices equipped with Wi-Fi, GPS, LTE and other wireless communication functions.

The 360 -degree EMC shielding design can not only prevent electromagnetic noise radiation from the contact point of the public and mother seats, but also prevent electromagnetic noise radiation from the lineboard installation part (SMT position) from the signal terminal. In addition, when the connector is cocks and correctly ground to the line board, the public seat and the mother seat shielding cover is correctly connected to multi -point ground. This ensures that the current generated in the metal shield of the connector has sufficient ground return path. This is to suppress the electromagnetic noise of the shielding layer.

●The entire connector is blocked by 360 degrees, including the public seat and the mother seat

●The shielding cover-shielding interface between the public seat and the mother seat is effectively connected on multiple points.

●The interface of the connecter shield-line board is effectively grounded at multiple points, thereby improving the ground return path.

With these design characteristics, the connector itself provides a significant EMI relief. Zenshield® provides engineers with greater flexibility to design lineboards. It makes the connector closer to the sensitive subsystem, such as launch/receiving antenna, which is a common high -performance wireless communication system.

Automatic manufacturing and inspection process

Risk of galvanic corrosion of dissimilar metals and matching connectors

When SAMTEC selects a connector for your application, it is important to select a companion connector with a similar plating material in the contact area. Different metals in the contact area can cause galvanic corrosion. Galvanic corrosion is an electrochemical process in which when two metals come into electrical contact in the presence of an electrolyte, one metal preferentially corrodes the other.

The figure below shows how different electroplating materials react with each other in terms of their potential. The greater the absolute value at the intersection of two electroplating materials, the greater the possibility of galvanic corrosion. If the number is highlighted in green, the material combination has a low current potential and is preferred. If the numbers are highlighted in yellow, the combination is not optimal, but is still acceptable. If it is not highlighted, the potential is high and you may not want to use this combination.

Plating options on connectors:

Most PCB-grade connectors are either gold-plated, tin-plated, or have selective gold/tin. Designers often ask us which plating finish we recommend. There are many considerations to consider (as evidenced by the variety of plating options on most basic connectors), but the best plating surface finish meets your system requirements at the lowest cost. In other words, make sure it works and meets your quality design specifications, but don’t over-engineer the plating.

Gold is usually specified for high reliability, low voltage or low current applications. Gold is used in high cycle applications because it is rugged and has excellent wear resistance (this is an example of a high cycle connector).

Tin is a lower cost alternative to gold and has excellent weldability. Unlike gold, tin is not a precious metal. The tin plating begins to oxidize the moment it is exposed to air. Therefore, the tinning contact system requires a larger normal force and a longer contact wiping area to break through this oxide film. Hopefully this video shows you what I’m trying to explain. The connectors shown are SSW series.

Validating the Performance of Miniature Array Connectors

Small, complex, and portable applications (in industries such as military/aerospace and medical) require miniaturized, reliable interconnects. As traditional surface-mount and through-hole interconnects reach their limits in terms of density and the number of signals that can effectively be used, many product designers are implementing high I/O array styles of interconnects. In a new white paper from Samtec, “Improved Solder Joint Integrity for High-Density Interconnect Applications,” the authors, Robbie Huffman and David Decker, detail the design characteristics and verification testing used to validate the robustness of the solder joints as well as the signal integrity in these next-generation board-to-board (B2B) surface mount area arrays (SMAAs).

While pin-in-ball SMAAs have been widely used in the industry for decades, they have lacked IPC classification. The demand for B2B SMAAs compatible with IPC-A-610 and IPC J-STD-001 Class 3 acceptance criteria is increasing as these types of interconnects are necessary to advance the state of the art for space-constrained applications in areas such as medical and military/aerospace design. The work in this paper shows that next-generation grid array interconnects meet the solder joint reliability and signal integrity performance required to support these high-reliability high-speed applications.

The white paper steps through detailed analysis of the new SMAA connectors, including improved automated x-ray inspection (AXI) as well as reliability testing per IPC-9701 and EIA-364-1000 test methods. The analysis includes both pin-in-ball and non-solder ball versions.

The tail of the next-generation pin-in-ball grid array component incorporates a fully plated, rounded, and coined bottom with contoured sides for increased robustness and an attached collapsible solder ball (Figure 1). These components are typically soldered to round land patterns. Samtec also offers non-solder ball versions, which use the same tail style but are soldered with increased solder paste volume in lieu of an attached solder ball (Figure 2).

The contoured tail style allows deeper tail penetration and an increased solderable surface area with signal integrity performance that supports data rates up to 112 Gbps PAM4 (56 Gbps NRZ) with robust and reliable solder joints that meet industry standards.

Bringing Vision to the Smart Factory

Embedded vision systems are becoming part of everyday life.  The development of autonomous cars has caught the headlines, and the use of visual systems will play a key role in their future success.  Embedded vision will be combined with other sensors to provide guidance for the vehicle.  Systems such as lidar (light direction and ranging) will measure distance, and the embedded vision systems will provide object recognition.  With this technology, the vehicle will be able to identify potential obstacles and react accordingly. 

The automotive industry, with its headline-grabbing developments, represents the most public example of embedded vision systems for collision avoidance.  However, the same technology has a range of applications in the industrial world.  As operators are employing more autonomous robots in the factory environment, the need for collision avoidance grows.   Embedded vision systems will allow factory robots to identify potential hazards and act in the most appropriate way.  This will keep the factory safe whilst maintaining the best possible efficiency. 

Keeping Everyone Safe

Embedded vision systems also have applications with the area of machine safety.  The task of providing safe working areas continues to grow in complexity as manufacturing plants become more flexible.  Not only do machines have to detect possible hazards, but it is also vital for them to understand the nature of the hazard in real time so that the right action can be taken to prevent accidents.  It is only with the sophistication of modern embedded vision systems that this has become truly possible.

Embedded vision systems also bring benefits to the efficient production line.  On any production line, one of the key tasks it quality control.  If the only source of quality control is manual inspection, manufacturers are forced to choose between random sampling or 100% inspection.  The first method tries to predict the quality of the entire batch based upon a random selection of products.  This is process introduces fewer delays but can risk the release of faulty products if the sample is too small.  The alternative – 100% inspection – is considerably slower and therefore makes the process more expensive.

Integration into the Smart Factory

As a solution, the sophistication of modern embedded vision systems allows automated, 100% visual inspection.  Each item can be imaged by a dedicated camera and its dimensions compared to the standard in real time.  The result is that faulty products can be identified immediately and discarded (or retained for further analysis).  This immediate inspection also provides important data that can be used to understand maintenance needs and even predict future failures. 

This use of data is at the heart of the smart factory concept.  For example, vision systems might identify a rising trend in faults from a molding machine, which could suggest the need for corrective maintenance.  This information can be correlated with other data collected from the same machine, including temperatures and energy consumption.  By analyzing all the associated data, the maintenance of the machine can be planned before a major failure occurs, which in turn minimizes the disruption to production.

New Applications

Embedded vision systems are continually being developed to make them smaller, more cost effective and more capable.  Their ease of use makes them an increasingly effective solution for a wide range of applications in the smart factory, from logistics to safety.  They will form part of the factory network and share data to increase the integration of all systems. 

Samtec manufactures a range of connectors that are ideal for the data requirements of the smart factory.  From high density, board-to-board connectors like the AcceleRate® family to high-performance RF connectors, the Samtec range has a fantastic selection of connectors that are ideal for the integration of embedded vision systems. 

Microwave, mmWave Connector Systems Achieve Excellent Performance

Magnum RF™ Ganged SMPM – mmWave

The first demo board highlights the board-to-board capabilities of our Magnum RF™ product line. Magnum RF is a multiport solution that incorporates an SMPM interface into a single housing allowing for density not possible with individual SMPM connectors.

Specifically, we see a Samtec Magnum RF edge launch, mated in a perpendicular configuration with a vertical, solderless, compression mount GPPC series.

Looking at the measurement results, we see insertion loss plots with the raw data at a maximum of -4 dB. Looking at the VSWR, we see a stable connection with a maximum of 1.5 VSWR up to 40 GHz. We’re measuring the two-piece, perpendicular connector system and the two PCB traces, at about 1” each. 

Magnum RF™ Ganged Cable – mmWave

The second demo is a Magnum RF cable assembly system. In addition to improved density, this ganged cable assembly provides a more secure connection to the mating connector with the housing, preventing any external forces from reaching the individual SMPM positions.  

This consists of a Magnum RF edge launch connector and a GC47 cable assembly.  Again, Magnum RF is ganged SMPM connectors. This is ideal when space is limited and a high operating frequency is required. 

Looking at the measurement parameters of the edge launch connector and .047 low loss mmWave cable assembly, the IL is under -5 dB at 40 GHz, and the VSWR is about 1.4.

2.40 Solderless, Compression Mount Edge Launch

Next, we have two solderless, compression mount 2.40 mm edge launch connectors, on the same PCB, connected by a 2” trace. Compression, edge launch connectors are the answer when the best VSWR is required for your application. 

For the full transmission line we’re looking at a maximum insertion loss of -6 dB at 50 GHz. The VSWR remains at 1.2 to 50 GHz.

2.92 Solderless, Compression Mount Edge Launch

And finally, in the same configuration, we have two solderless, compression mount 2.92 mm edge launch connectors, with 2” of trace. 

Once again, we see strong results: the insertion loss to 40 GHz, for the full channel, is less than -4 dB, and the VSWR is a maximum of 1.3, to 40 GHz.

Also, the orange cables used in this demonstration are Samtec’s new line of next-generation phase stable microwave coax. They provide improved stability and flexure over time, compared to typical coax cables. We’ll be telling you more about these orange cables soon.