The deployment of the 5G network and its connection device will put forward higher requirements for the current connector structure. For large quantities of manufacturing, the investment of connectors technology must be balanced between performance, size and cost in order to flourish in the market.
For the application of Gigabitz, the demand for internal and external electromagnetic interference sources (EMI) is a unique challenge for 5G applications. Take 5G mobile phones as an example. It contains multiple subsystems (GPS, Wi-Fi, Honeycomb Sub-6 GHz, and MMWAVE 5G). These subsystems need to work together to minimize the problem of the antenna failure and ensure that the entire subsystem is interactive sex. The millimeter -wave subsystem design for 5G mobile phones is used for effective millimeter wave radiation, and must also be located near the core of the sensitive CPU and the passive antenna. This can cause the problem of electromagnetic compatibility (EMC). There are many solutions to alleviate these problems. However, these solutions are often solutions for CNC processing and have a larger and heavier high shielding coaxial structure. 5G devices used for consumers need to be carefully balanced between performance, size and cost. The 5G UE device must break through the miniaturization limit and generate maximum performance to support these next -generation devices. This trend does not slow down; just as the problem of EMC does not show signs of simplicity.
The combination of micro -band and small wire small radio frequency coaxial connector with cable grounding and wire beam management solution represents a series of gradual EMI solutions. These components are small in size, shielded and low in price, and play a key role in the successful product engineer’s system EMI compliance strategy.
The industry -design industry standard procedures are: achieve performance goals; only after achieving performance goals can we optimize the balance between the size and cost constraints of the component. However, as the frequency continues to inevitably rise, electromagnetic interference suppression and isolation become a key “primary consideration” element at the beginning of the project.
Fortunately, a gradual and effective solution can help reduce the EMI system emissions to acceptable levels.
The first component choice is a low -cost, micro -version board -to -line solution. It provides a basic radio frequency coaxial connection for the PCB micro -band structure. Some radio frequency design can accept micro -band performance, and only occupy 2 layers of metal layers on PCB, thereby reducing the cost and thickness of PCB. However, for higher frequencies, it may not be able to fully suppress EMI radiation to pass compliance.
When the micro -band transmission line is not enough to meet the EMI performance requirements, a 3 -layer -shaped wire transmission structure may be adopted. In these cases, low -back, high -performance RF band -shaped wire connector is a solution.
In a high -performance environment, extra EMI countermeasures must be adopted, and adding SMT grounding clips must be helpful. This is a good low -cost tool that can greatly suppress EMI launch, thereby minimizing the workload of the redo -PCB layout.
By comparison Figure 4 and Figure 7, it is easy to see the improvement of the additional shielding performance of the addition of SMT cables after grounding.
We used ANSYS® HFS ™ S three -dimensional electromagnetic simulation to check the shielding performance of the following four situations.
Case 1 -Preset EMI performance, micro -band transmission line
A micro -band -band transmission wire case was used to use micro -band radio frequency connectors and simulated in HFSS. As shown in the figure, the micro -band structure allows radiation to escape the wave structure.
Case 1B -RF micro -band connector with additional SMT ground clip
With the increase of the SMT grounding clip, EMI radiation is limited to the area around the launch point, and the length of the micro line is significantly reduced. It should also be pointed out that although this will not be completely shielded, it does not require additional ground floor and new circuit board to rotate related costs.
Case 2 -requires a higher level of EMI performance.
Durable value design usually uses a 3 -layer -shaped wire transmission line structure. To this end, a new stamping connector solution came into being. The signal conductor is completely contained in the ground -defined boundary on both sides of the signal layer, which provides the best shielding in the PCB design
Case 2B -Banded line transmission cable with additional SMT ground clip and RF band -shaped wire connector provides the highest degree of EMI suppression
For the extreme sensitive system that requires the highest level EMI shielding inhibitory performance, the addition of the SMT grounding clip further enhances the performance of the RF shielded band -shaped line to a small RF coaxial connector.
in conclusion
Continuous improvement of EMI shielding performance can be used through:
1. Micro -band small radio frequency coaxial coaxial connector
2. Micro -band small radio frequency coaxial coaxial connector+SMT cable ground clip
3. Tape -like small radio frequency coaxial coaxial connector
4. Tape -like small radio frequency coaxial coaxial connector+SMT cable ground clip
With the rise of 5G devices, we have seen the performance pressure of the connection technology. The status of the stamping connector solution has become a challenge brought by 5G: performance, space and cost. The development of this technology will stimulate new solutions that emerge in the future and foreseeable future.
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