Zenshield® is the brand name of the I-PEX small connector series. These small connectors have high-performance EMC shielding design. Zenshield® provides engineers with greater flexibility to design lineboards. It makes the connector closer to the sensitive subsystem, such as launch/receiving antenna, which is a common high -performance wireless communication system.
Zenshield® is the brand name of the I-PEX small connector series. These small connectors have high-performance EMC shielding design.
With the development of high -speed Internet and the use of large -capacity storage equipment, high -resolution images and videos can be easier to share on consumer products such as personal computers, tablets and smartphones. The amount of information processed on these devices has increased sharply, and the signal speed in the device is getting faster and faster.
When electromagnetic noise is existed outside the electronic device, non -expected electrical signals may be imported from the circuit inside the device, causing faults or damage to high -performance electronic components, and may also cause damage to electronic equipment.
The second type of problem is when the electromagnetic noise generated by the digital timing signal or electronic component in the device causes other components in the same system to fail. This is called an EMC (electromagnetic compatibility) problem in the system. This often causes headaches for engineers. They must develop and install high -density electronic components, high -performance handheld or portable electronic equipment. When these types of devices need to be interconnected, in order to prevent electromagnetic noise from becoming a problem, connectors with electromagnetic interference shielding functions often need to be needed.
The unique shielding design of the I-PEX ZENSHIELD® connector series can provide excellent electromagnetic interference countermeasures.
The 360 -degree EMC shielding design can not only prevent electromagnetic noise radiation from the contact point of the public and mother seats, but also prevent electromagnetic noise radiation from the lineboard installation part (SMT position) from the signal terminal. In addition, when the connector is cocks and correctly ground to the line board, the public seat and the mother seat shielding cover is correctly connected to multi -point ground. This ensures that the current generated in the metal shield of the connector has sufficient ground return path. This is to suppress the electromagnetic noise of the shielding layer.
Zenshield® connector series design:
1. The entire connector is blocked by 360 degrees, including the public seat and the mother seat -not only the terminal part of the signal terminal, but also the lineplate installation part (SMT position).
2. The shielding cover-shielding interface between the public seat and the mother seat is effectively connected on multiple points.
3. In addition, the interface of the connecter shielding cover-line board is effectively grounded at multiple points, thereby improving the ground return path.
With these design characteristics, the connector itself provides a significant EMI relief. Zenshield® provides engineers with greater flexibility to design lineboards. It makes the connector closer to the sensitive subsystem, such as launch/receiving antenna, which is a common high -performance wireless communication system.
The Zenshield® connector series that can be provided:
The I-PEX Zenshield® connector series provides a variety of electromagnetic interference shielding connectors to meet various applications and design conditions.
Extremely fine coaxial connector:
Cabline®-CA II/CA II Plus (0.4 mm pitch, horizontal plug-in style, mechanical lock function)
Cabline®-VS II (0.5 mm pitch, horizontal plug-in style, mechanical lock function)
Cabline®-UM (0.4 mm pitch, vertical plug-in style, automatic locking function)
RF connector:
MHF® 7s (packaging 2.0 x 2.0 mm, as high as 15 GHz)
Board panel (FPC) connector:
NOVASTACK® 35-HDP (supports high-speed transmission (20+ GBPS/LANE) full shielding structure, with a power supply terminal, 0.35 mm spacing, height: 0.7 mm)
NOVASTACK® 35-HDN (suitable for 5G MMWAVE antenna module and equipment, full shielding and narrow design, the power supply adopts Cordon alloy terminal, 0.35 mm pitch, height 0.7 mm)
Novastack® 35-HDH (height 1.5 mm, 0.35 mm spacing, full shielding, high-back design, high-speed 20 GHz (≒ 40 GBPS)/channel transmission)
FPC/FFC connector:
EVAFLEX® 5-HD (0.5 mm pitch, with automatic lock function)
Cabline®-CA IIF (0.4 mm pitch, mechanical lock function)
Cabline®-VS IIF (0.5 mm pitch, with mechanical lock function)
Related term:
* Electromagnetic interference (EMI):
There are two types of electromagnetic interference conduction pathways: radiation and/or conduction.
1. When high -frequency signals are spread on the conductive surface (or wire or PCB lead), the electromagnetic field that changes over time, that is, radiation interference. This electromagnetic field can be detected (radiation) at a certain distance from that surface. The closer the distance between the light source and the adjacent surface (or wire or PCB), the larger the detected coupling field. Since the adjacent surface is conductive, it acts the voltage and current when the electromagnetic field exists. Solving this problem usually requires shielding housing, cables and connectors. If no part of the system is shielded, it will be an EMI radiation leakage point.
2. When the intention (or unintentional) signal in the circuit is directly moved from one place to another through the wire (or wire or PCB lead), it will interfere with the normal operation of the target circuit or device that is transmitted. Electric power line is an example of conduction interference. In this case, use a wire filter, capacitor network, and similar methods to separate (or adjust) voltage signals from interference voltage.
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